On November 6th, chipmaker MediaTek launched the Dimensity 9300, its flagship mobile SoC that aims to challenge the Snapdragon 8 Gen 3 announced by Qualcomm two weeks ago. The Dimensity 9300 uses TSMC’s 3rd-generation 4nm+ technology, is made of 22.7 billion transistors, and features a new “All-Big-Core” CPU architecture dedicated to performance. MediaTek claims improved […]